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Shenzhen Sinic-Tek Vision Technology Co., Ltd.

Laser Marking Machine, SMT Screen Printer, Aoi manufacturer / supplier in China, offering After Mpm Printer 3D Solder Paste PCB Inspection SMT Machine, After Dek Printer 3D Solder Paste PCB Inspection SMT Machine, 3D Solder Paste PCB Inspection SMT Machine Worldwide Use and so on.

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3D SPI application [Mar 02,2017]
3D SPI application
   3D SPI application
From the initial solder paste thickness gauge to the current automatic three-dimensional solder paste detector, solder paste detection system has been developed for more than a decade, more and more SMT users began to pay attention to the application of solder paste detection system. How to look at the application of solder paste detection system (SPI), the following simple to talk about feelings;
* Components are miniaturized
* Pin pitch is densely packed
* The widespread use of lead-free solder paste
* The rise in manpower costs
* One-time pass rate control
The sooner the problem will be able to solve the problem sooner, component costs, processing costs, repair costs, one-time pass rate, customer satisfaction, etc. all the time plagued SMT managers. There are too many reasons for the current SMT users will continue to move forward the means of moving forward from the ICT to the furnace after the AOI, and then forward to the furnace before the AOI, and then forward to the front of the SPI chip.
   SPI has two basic functions;
1) timely detection of print quality defects
SPI can be intuitive to tell the user, which solder paste printing is good, which is bad, and provide a limited type of tips.
2) through a series of solder joint testing, found that the trend of quality changes.
All trend changes are caused by one or more potential factors. We can not see the potential factor, but we can see the trend change. Thereby analyzing potential factors through trend changes.
SPI is through a series of solder paste detection, found that the quality of the trend, before the quality is not out of range to find out the potential factors that cause this trend, such as the printing press control parameters, human factors, solder paste changes factors. And then timely adjustment, control trends continue to spread.
 
  SPI for the specific test items, can be done on the volume, area, height, XY offset, shape, bridge automatic detection. The mainstream PMP (phase modulation profile measurement technique) has reached the micron level detection accuracy. And laser scanning detection methods have been gradually introduced in the solder paste detection market.
 
   SPI as a hardware device, it can be found in a timely manner print quality defects. But to find trends change, you need to have a strong SPC (process control software) to be assisted. SPC can analyze and compare the results of a series of solder paste, and provide a trend distribution. The results of the test of the solder paste are analyzed and compared, and the distribution of the trend is provided. General XBar-S, XBar-R, Histogram, Single View, Multi View, CP, CPK, G & GR and other reports are indispensable tools.
 
   Currently on the market function and technology more advanced SPI has Kohyoung, Sinic-Tek TRI, CKD.