The use of conventional solder paste gauges is becoming more and more obvious in the current solder paste testing. The solder paste thickness gauge is mainly used to measure the solder paste at a certain point. The use of the detection light source for the laser, the laser beam in different height plane generated distortion, manual mouse click to measure the height of the way.
While the detection of solder paste only measuring the height is completely inadequate. The control of the volume of the solder paste is critical to the printing process. The same area can have different size, the same volume may have different areas and so on. The solder paste thickness gauge can only be a single point or a few points to detect, but these points really have the ability to represent the whole board solder joints? the answer is negative. A solder joint and a solder joint have a unique, if any solder joint defects will cause the whole board of the bad.
So, the real 3DSPI is used to solve these problems. 3DSPI can fully detect all the solder joints of the whole board, including volume, area, height, XY offset, shape, bridge and so on, and with the powerful SPC process control software, off-line equipment to the regular sampling method of printing Machine printing quality monitoring, online equipment can be done on the SMT production line for each piece of circuit board for testing. This kind of equipment to PMP white light detection as the mainstream to Sinic-Tek T series as the representative of the off-line automatic board detection system and InSPIre series of online three-dimensional solder paste detection system for SMT printing process detection and control provides a complete solution The