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Shenzhen Sinic-Tek Vision Technology Co., Ltd.

3D Spi, Inspection Machine, Solder Paste Inspection manufacturer / supplier in China, offering High Precision 3D Spi Solder Paste Inspection for SMT Line, 20W 30W 50W Metal Nonmetal Fiber Laser Marking Machine Price, 3D Solder Paste Inspection PCB Spi Machine Online Single Track and so on.

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Supplier Homepage Product Solder Paste Inspection Online SPI High Precision 3D Spi Solder Paste Inspection for SMT Line

High Precision 3D Spi Solder Paste Inspection for SMT Line

FOB Price: US $1-20,000 / set
Min. Order: 1 set
Min. Order FOB Price
1 set US $1-20,000/ set
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Port: Shenzhen, China
Production Capacity: 50 Sets/Month
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: Ultra Series
  • Condition: New
  • Warranty: 12 Months
  • Driven Type: Electric
  • Weight: 950kgs
  • Air Pressure: 4-6bar
  • Maximum Loading PCB Size: X330*Y250mm
  • Transport Package: Standard Wooden Package
  • HS Code: 9031499090
  • Function: High Temperature Resistance
  • Certification: SGS, ISO, CE
  • Automatic Grade: Automatic
  • Machine Dimension: 1000*1000*1525mm
  • Power: 220V,10A
  • Fov Size: 38.4*30.6mm
  • Trademark: Sinic-Tek
  • Origin: China
Product Description
High Precision 3D Spi Solder Paste Inspection for SMT Line

High Precision 3D SPI Solder Paste Inspection for SMT Line


Features:
1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line.
2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically driven by a piezoelectric motor(PZT).By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use and avoid mechanical wear and reduce maintenance costs.
3.By using the Stop&Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.
4.Patened D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.
5.Gerber data conversion and import, achieve automatic detection of the entire board. Manual "teach" function realize user-friendly programming and test job generation in case of no Gerber data situation.
6. The maximum detectable height increased from the traditional±350um to±1200um, not only can detect solder paste, also applies to the detection of opaque objects, such as red glue and black epoxy and other none transported object.
7.Friendly and simple user interface, five minutes of programming and one key operation.
8.Powerful "statistical process control(SPC)", Provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.
9.The application range like: mobile phones, tablet PC, computer and accessories, digital cameras, camcorders, automotive, medical, server, LED, FPC, communication products etc.
High Precision 3D Spi Solder Paste Inspection for SMT Line

 
Products DescriptionUltra high precision Model
Model Ultra series
Measurement Principle3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly 
known as moire fringe technology)
MeasurementsVolume,acreage,height, XYoffset, shape  
Detection of Non - Performing TypesMissing print,insufficient tin, excessive tin, bridging, offset,  mal-shapes, surface 
contamination
Camera Pixel5M, 8M/12M as option
Lens TypesTelephoto lens, telecentric lens as option
Lens Resolution10um(8/13/15/18/20um  as option)
FOV Size38.4*30.6mm
(20.5*16.3/25.6*24.5/33.3*26.5/46.1*36.7/51.2*40.8mm)
AccuracyXY Resolution):1um;Height:0.37um, Light grating resolution:0.5um
RepeatabilityHeight:<1um (6 Sigma);volume/acreage:<1%(6 Sigma)
Gage R&R<10%
FOV  Speed0.3s/FOV
Quantity of Inspection HeadTri-Heads (Four Heads as option)
Red Green Blue/RGB Three Colas 
Option Light Source
Standard  configuration
Mark-point Detection Time0.5 sec/piece
Compensation Plate Bending 
of Real-time Lift in Z-axis
Standard  configuration
Maximun Meauring Height±550um ( ±1200um as option)
Maximun Measuring Height 
of PCB Warp 
±5mm
Minimum Pad Spacing100um ( pad height of 150um as the reference)
Smallest  Measuring SizeRectangle:150um;Round:200um
Maximum Loading PCB SizeS:X330*Y250mm
L:X510*Y505mm
LL:X630*Y550mm
Thickness of the PCB0.4-7mm
Height Limitations of the PartsTop30mm,Bottorm40mm
Board Edge Distance3mm , (multifunctional clip edge  as option)
Flixble or Fixed Orbit SettingFront orbit  (back orbit as option)
PCB Transfer DirectionLeft to right or right to left
Orbit Width AdjustmentManual, automatic as option
SPC StatisticsHistogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability 
Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data ImputSupport Gerber format(274x,274d);Manual Teach model ;
CAD X/Y,Part No.,Package Type imput
Industry 4.0 Configuration1D/2D camera Barcode, Badmark function, print closed-loop control
Computer type DELL Precision Workstation
Computer ConfigurationCPUIntel 6-core (Intel double CPU 12-core as option)
RAM24G(32/48G as option)
GPU2G discrete graphics (4G DP as option)
Hard disk1T (2T as option)
DVD+RWStandard  configuration
Operating System Windows 7 Professional ( 64 bit)
Equipment Diemension 
and Weight
W1000xD1000xH1525mm;950KG
Power220V,10A
Air Pressure4~6Bar
Power (Start / nornmal)Start:2.5kw /  Normal operation:2kw
Loading Requirements 
of the Floor
600kg/m²
OptionsMultifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, print 
closed-loop control, out-line programming software, maintenance was 
optionkstations, dynamic  Mark point  read function, coaxial  Mark  point camera , 
UPS continuous power supply 
 

 High Precision 3D Spi Solder Paste Inspection for SMT Line


 
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