Gold Member Since 2017
Audited Supplier
Shenzhen Sinic-Tek Vision Technology Co., Ltd.

Fbc Spi, PCBA, PCB manufacturer / supplier in China, offering 3D Solder Paste Inspection PCBA Special Use for FPC F8, High Precision Online 3D Solder Paste Inspection, SMT Inspection Online Solder Paste Inspection Machine Spi and so on.

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Supplier Homepage Product Solder Paste Inspection SPI for FPC 3D Solder Paste Inspection PCBA Special Use for FPC F8

3D Solder Paste Inspection PCBA Special Use for FPC F8

FOB Price: Get Latest Price
Min. Order: 1 Piece
Port: Shenzhen, China
Production Capacity: 50sets
Payment Terms: L/C, T/T, Western Union

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Basic Info
  • Model NO.: F8
  • Demoulding: Automatic
  • Certification: CCC, RoHS, ISO, CE
  • Automatic Grade: Automatic
  • Driven Type: Electric
  • Trademark: Sinic-Tek
  • Specification: 1000*1000*1525mm 820KG
  • HS Code: 9031499090
  • Function: High Temperature Resistance, Anti-Corrosion, Anti-Cold
  • Condition: New
  • Warranty: 12 Months
  • Installation: Desktop
  • Mould Life: 300,000-1,000,000 Shots
  • Transport Package: Standard
  • Origin: China
Product Description
3D Solder Paste Inspection PCBA Special Use for FPC F8

SPI special use for FPC F8:
Products Description and Specifications of F8 series

1. Programmable phase modulation profilermetry (PSLM PMP): Sinic-Tek patents, its unique programmable grating structure can use the software to set period of the grating; canceled the mechanical drive and transmission parts, greatly improving the accuracy of the equipment and scope of application, avoiding mechanical wear and maintenance costs and achieving 100% precision 3D measurement towards the printed solder paste in SMT production line. 
2. Sinic-Tek patent together with structured light technology solve problem of shadow interference in 3D solder Paste Inspection. Combined with RG-dimensional light source, it can perfect handle high-contrast substrates such as black substrate, ceramic substrate and so on. Using red, blue and green light, it can provide colored 2D image; 
3. High resolution image processing system: Ultra frames four million pixels industry CCD camera, with high-end camera, supports the fast and stable detection of 01005 solder paste. While providing 10um, 15um, 18um, 20um etc. a variety of different detection accuracy, to meet the customer's requirements as product diversity and inspection speed.
4. Quick Gerber import and programming software, can achieve 5 minutes programming, which is the fastest in the industry; artificial Teach function is convenient for programming and inspection even in the absence of Gerber data.
5. Z-axis real-time dynamic profiling: the features of PSLM provides a real-time dynamic tracking for PCB warpage change , and perfect solve the problem of flexible circuit boards and PCB warpage.
6. Powerful process statistical analysis (SPC): Real-time SPC information display, complete and various SPC tool that allows the users to real-time monitor problems in the production , reduce the defects caused by bad solder paste printing. It will support the operator with a strong quality control , allow the users to be be clear at a glance.
7.Equipment Repeatability << 10%.
3D Solder Paste Inspection PCBA Special Use for FPC F8

Equipment Hardware and Software Configuration:
ModelSPI special use for FPC   F8
Measurement Principle3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly 
known as moire fringe technology)
MeasurementsVolume,acreage,height, XYoffset, shape  
Detection of Non - Performing TypesMissing,insufficient tin, excessive tin, bridging, offset,  mal-shapes, surface 
Camera Pixel5M
Lens TypesTelecentric lens
Lens Resolution15um,or 13um/10um
FOV Size38.4*30.6mm,or 33.3*26.5mm/25.6*24.5mm
Mark Point Cameras and 
Coaxial Light Source
Optional configuration
AccuracyXY Resolution:1um;Height:0.37um
RepeatabilityHeight:<1um (4 Sigma);volume/acreage:<1%(4 Sigma)
Gage R&R<10%
FOV  Speed0.35s/FOV
Quantity of Inspection HeadTwin-Heads(orTri-Heads)
Red Green Blue/RGB Three Colas 
Option Light Source
Standard  configuration
Mark-point Detection Time0.5 sec/piece
Compensation Plate Bending 
of Real-time Lift in Z-axis
Standard  configuration
Maximun Meauring Height±550um ( ±1200um as option)
Maximun Measuring Height 
of PCB Warp 
Minimum Pad Spacing100um (pad height of 150um as the reference)
Smallest  Measuring SizeRectangle:150um;Round:200um
Maximum Loading PCB SizeM:X330xY250mm
Thickness of the PCB0.4-7mm
Height Limitations of the PartsUp:40mm  down:40mm
Board Edge Distance3mm , (multifunctional clip edge  as option)
Flixble or Fixed Orbit SettingFront orbit  (back orbit as option
PCB Transfer DirectionLeft to right or right to left
Orbit Width AdjustmentManual and automatic (front orbit or back orbit
SPC StatisticsHistogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability 
Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data ImputSupport Gerber format(274x,274d);Manual Teach model) ;
CAD X/Y,Part No.,Package Type imput
Computer typeDELL Image Workstation
CPUIntel 8-core
GPU2G discrete graphics (4G DP as option)
Hard disk1T 
DVD+RWStandard  configuration
Operating System Windows 7 Professional ( 64 bit)
Equipment Diemension 
and Weight
Power (Start / nornmal)Start:2.5kw /  Normal operation:2kw
Loading Requirements 
of the Floor
OptionsMultifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, print 
closed-loop control, out-line programming software, maintenance was 
optionkstations, dynamic  Mark point  read function, coaxial  Mark  point camera , 
UPS continuous power supply 

If you have any questions, please contact me or call me directly
3D Solder Paste Inspection PCBA Special Use for FPC F8
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