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Shenzhen Sinic-Tek Vision Technology Co., Ltd.

Spi, Optical Inspection, Solder Paste Inspection manufacturer / supplier in China, offering Automatic Online 3D Aoi Inspection, High Precision Online 3D Solder Paste Inspection, SMT Inspection Online Solder Paste Inspection Machine Spi and so on.

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Supplier Homepage Product Solder Paste Inspection Online SPI Automatic Online 3D Aoi Inspection

Automatic Online 3D Aoi Inspection

FOB Price: US $1 / Piece
Min. Order: 1 Piece
Min. Order FOB Price
1 Piece US $1/ Piece
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Port: Shenzhen, China
Production Capacity: 50 Sets/Month
Payment Terms: T/T

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Basic Info
  • Model NO.: S8030
  • Condition: New
  • Warranty: 12 Months
  • Driven Type: Electric
  • Weight: 830kgs
  • Maximum Loading PCB Size: X330*Y250mm
  • Trademark: Sinic-Tek
  • Origin: China
  • Function: High Temperature Resistance
  • Certification: ISO, CE
  • Automatic Grade: Automatic
  • Machine Dimension: 1000*1000*1525mm
  • Power: 220V,10A
  • Fov Size: 36*36mm
  • Transport Package: Standard Wooden Package
  • HS Code: 9031499090
Product Description
Automatic Online 3D Aoi Inspection

Automatic Online 3D AOI Inspection

Features:
1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line.
2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically driven by a piezoelectric motor(PZT).By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use and avoid mechanical wear and reduce maintenance costs.
3.By using the Stop&Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.
4.Patened D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.
5.Gerber data conversion and import, achieve automatic detection of the entire board. Manual "teach" function realize user-friendly programming and test job generation in case of no Gerber data situation.
6. The maximum detectable height increased from the traditional±350um to±1200um, not only can detect solder paste, also applies to the detection of opaque objects, such as red glue and black epoxy and other none transported object.
7.Friendly and simple user interface, five minutes of programming and one key operation.
8.Powerful "statistical process control(SPC)", Provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.
9.The application range like: mobile phones, tablet PC, computer and accessories, digital cameras, camcorders, automotive, medical, server, LED, FPC, communication products etc.

Automatic Online 3D Aoi Inspection
Automatic Online 3D Aoi Inspection
Automatic Online 3D Aoi Inspection

 
Products DescriptionStandard Model
Model S8030
Measurement Principle3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly 
known as moire fringe technology)
MeasurementsVolume,acreage,height, XYoffset, shape  
Detection of Non - Performing TypesMissing print,insufficient tin, excessive tin, bridging, offset,  mal-shapes, surface 
contamination
Camera Pixel4M, 5M as option
Lens TypesTelephoto lens, telecentric lens as option
Lens Resolution18um(20/15um  as option)
FOV Size36*36mm
AccuracyXY Resolution):1um;Height:0.37um
RepeatabilityHeight:1um (4 Sigma);volume/acreage:<1%(4 Sigma)
Gage R&RFar less than 10%
FOV  Speed0.35s/FOV
Quantity of Inspection HeadSingle Head (Twin-Heads as option)
Red Green Blue/RGB Three Colas 
Option Light Source
Standard  configuration
Mark-point Detection Time0.5 sec/piece
Compensation Plate Bending 
of Real-time Lift in Z-axis
Standard  configuration
Maximun Meauring Height±550um ( ±1200um as option)
Maximun Measuring Height 
of PCB Warp 
±3.5mm(±5 as option)
Minimum Pad Spacing100um ( pad height of 150um as the reference)
Smallest  Measuring SizeRectangle:150um;Round:200um
Maximum Loading PCB SizeM:X330xY250mm
L:X510xY505mm
Thickness of the PCB0.4-7mm
Height Limitations of the PartsTop30mm,Bottorm40mm
Board Edge Distance3mm , (multifunctional clip edge  as option)
Flixble or Fixed Orbit SettingFront orbit  (back orbit as option)
PCB Transfer DirectionLeft to right or right to left
Orbit Width AdjustmentManual, automatic as option
SPC StatisticsHistogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability 
Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data ImputSupport Gerber format(274x,274d);Manual Teach model ;
CAD X/Y,Part No.,Package Type imput
Computer type DELL server
CPUIntel 4-core
RAM16G(24/32G as option)
GPU2G discrete graphics 
Hard disk1T 
DVD+RWStandard  configuration
Operating System Windows 7 Professional ( 64 bit)
Equipment Diemension 
and Weight
S:1000x1000x1525mm;830KG
L:1000x1000x1525mm;865KG
Power220V,10A
Air Pressure4~6Bar
Power (Start / nornmal)Start:2.5kw /  Normal operation:2kw
Loading Requirements 
of the Floor
500kg/m²
OptionsMultifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, print 
closed-loop control, out-line programming software, maintenance was 
optionkstations, dynamic  Mark point  read function, coaxial  Mark  point camera , 
UPS continuous power supply 

Automatic Online 3D Aoi Inspection
Automatic Online 3D Aoi Inspection
 
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