off-Line 3D Spi Automatic Optical Inspection Machine
|FOB Price:||Get Latest Price|
|Min. Order:||1 Piece|
|Production Capacity:||50 Sets/Month|
|Payment Terms:||L/C, T/T|
- Model NO.: T-2010a
- Condition: New
- Warranty: 12 Months
- Driven Type: Electric
- Weight: 95kgs
- Air Pressure: 4-6bar
- Trademark: Sinic-Tek
- Origin: China
- Function: High Temperature Resistance
- Certification: ISO, CE
- Automatic Grade: Automatic
- Machine Dimension: 810*930*530mm
- Power: 220V,10A
- Maximum Loading PCB Size: X460*Y350mm
- Transport Package: Standard Wooden Package
- HS Code: 9031499090
Off-line 3D SPI Automatic Optical Inspection Machine
1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line.
2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically driven by a piezoelectric motor(PZT).By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use and avoid mechanical wear and reduce maintenance costs.
3.By using the Stop&Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.
4.Patened D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.
5.Gerber data conversion and import, achieve automatic detection of the entire board. Manual "teach" function realize user-friendly programming and test job generation in case of no Gerber data situation.
6. The maximum detectable height increased from the traditional±350um to±1200um, not only can detect solder paste, also applies to the detection of opaque objects, such as red glue and black epoxy and other none transported object.
7.Friendly and simple user interface, five minutes of programming and one key operation.
8.Powerful "statistical process control(SPC)", Provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.
9.The application range like: mobile phones, tablet PC, computer and accessories, digital cameras, camcorders, automotive, medical, server, LED, FPC, communication products etc.
|Measurement Principle||3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly |
known as moire fringe technology)
|Measurements||Volume,acreage,height, XY offset, shape|
|Detection of Non - Performing |
|Missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination|
|FOV Size||26 X 20mm|
|Accuracy||XY direction):10um; height:0.37um|
|Repeatability||Height:<1um (4 Sigma);volume/acreage:<1%(5 Sigma)|
|Gage R&R||Far less than 10%|
|Quantity of Inspection Head||Single Head|
|Mark-point Detection Time||0.5 sec/piece|
|Maximun Meauring Height||±350um (±1200um * as optipon)|
|Maximun Measuring Height |
of PCB Warp
|Minimum Pad Spacing||100um (pad height of 150um as the reference)|
|Smallest Measuring Size||Rectangle:150um; round:200um|
|Maximum Loading PCB Size||X460 x Y350 mm|
|Fixed or Flexible Orbit Setting||Front orbit|
|Engineering Statistics||Histogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability |
Data;SPI Daily/Weekly/Monthly Reports
|Gerber & CAD Data Import||Support Gerber format(274x,274d);manual Teach model ;|
CAD X/Y,Part No.,Package Type imput)
|Operating System Support||Windows 7 Professional (32 bit)|
|Equipment Diemension |
|810 x 930 x 530mm;95KG|
|Options||1D / 2D Barcode scanner;UPS continuous power supply;workstation |