Gold Member Since 2017
Audited Supplier
Shenzhen Sinic-Tek Vision Technology Co., Ltd.

Spi, Aoi, Screen Printer manufacturer / supplier in China, offering 3D Solder Paste Inspection Machine Special Use for PCBA, on-Line 3D Spi Machine / Solder Paste Inspection Machine (SPI-3D), in-Line 3D Spi Machine / Solder Paste Inspection Machine and so on.

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Supplier Homepage Product Solder Paste Inspection SPI for Battery Protection Board 3D Solder Paste Inspection Machine Special Use for PCBA

3D Solder Paste Inspection Machine Special Use for PCBA

FOB Price: Get Latest Price
Min. Order: 1 Piece
Transport Package: Standard
Payment Terms: L/C, T/T, Western Union

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Basic Info
  • Model NO.: B3
  • Demoulding: Automatic
  • Certification: CCC, ISO, CE
  • Automatic Grade: Automatic
  • Driven Type: Electric
  • Trademark: Sinic-Tek
  • Origin: China
  • Function: High Temperature Resistance
  • Condition: New
  • Warranty: 12 Months
  • Installation: Desktop
  • Mould Life: 300,000-1,000,000 Shots
  • Specification: 1000*1000*1525mm 820KG
  • HS Code: 9031499090
Product Description
3D Solder Paste Inspection Machine Special Use for PCBA
Products Description and Specifications of B3 series:

1. Programmable phase modulation profilermetry (PSLM PMP): Sinic-Tek patents, its unique programmable grating structure can use the software to set period of the grating; canceled the mechanical drive and transmission parts, greatly improving the accuracy of the equipment and scope of application, avoiding mechanical wear and maintenance costs and achieving 100% precision 3D measurement towards the printed solder paste in SMT production line. 
2. Sinic-Tek patent together with structured light technology solve problem of shadow interference in 3D solder Paste Inspection. Combined with RG-dimensional light source, it can perfect handle high-contrast substrates such as black substrate, ceramic substrate and so on. Using red, blue and green light, it can provide colored 2D image; 
3. High resolution image processing system: Ultra frames four million pixels industry CCD camera, with high-end camera, supports the fast and stable detection of 01005 solder paste. While providing 10um, 15um, 18um, 20um etc. a variety of different detection accuracy, to meet the customer's requirements as product diversity and inspection speed.
4. Quick Gerber import and programming software, can achieve 5 minutes programming, which is the fastest in the industry; artificial Teach function is convenient for programming and inspection even in the absence of Gerber data.
5. Z-axis real-time dynamic profiling: the features of PSLM provides a real-time dynamic tracking for PCB warpage change , and perfect solve the problem of flexible circuit boards and PCB warpage.
6. Powerful process statistical analysis (SPC): Real-time SPC information display, complete and various SPC tool that allows the users to real-time monitor problems in the production , reduce the defects caused by bad solder paste printing. It will support the operator with a strong quality control , allow the users to be be clear at a glance.
7.Equipment Repeatability << 10%.
3D Solder Paste Inspection Machine Special Use for PCBA

Equipment Hardware and Software Configuration:
Model  B3 
Measurement Principle3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly 
known as moire fringe technology)
MeasurementsVolume,acreage,height, XYoffset, shape  
Detection of Non - Performing 
Types
Missing,insufficient tin, excessive tin, bridging, offset,  mal-shapes, surface
contamination
Camera Pixel4M
Lens TypesTelePhoto lens
Lens Resolution18um,or 12/15um
FOV Size36*36mm
Mark Point Cameras and Coaxial 
Light Source
Optional configuration
AccuracyXY Resolution:1um;Height:0.37um
RepeatabilityHeight:<1um (4 Sigma);volume/acreage:<1%(4 Sigma)
Gage R&R<10%
FOV  Speed0.45s/FOV
Quantity of Inspection HeadSingle Heads
Red Green Blue/RGB Three Colas 
Option Light Source
Standard  configuration)
Mark-point Detection Time0.5 sec/piece)
Compensation Plate Bending 
of Real-time Lift in Z-axis
Standard  configuration
Maximun Meauring Height±550um ( ±1200um as option)
Maximun Measuring Height 
of PCB Warp 
±3.5mm
Minimum Pad Spacing100um (pad height of 150um as the reference)
Smallest  Measuring SizeRectangle:150um;Round:200um
Maximum Loading PCB SizeX330xY250mm
Thickness of the PCB0.4-7mm
Height Limitations of the PartsUp:40mm  down:40mm
Board Edge Distance3mm ,(multifunctional clip edge  as option)
Flixble or Fixed Orbit SettingFront orbit  (back orbit as option)
PCB Transfer DirectionLeft to right or right to left
Orbit Width AdjustmentManual and automatic (front orbit or back orbit)
SPC StatisticsHistogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability 
Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data ImputSupport Gerber format(274x,274d);Manual Teach model);
CAD X/Y,Part No.,Package Type imput
Computer typeDELL Image Workstation
CPUIntel 4-core
RAM8G 
GPU1G discrete graphics 
Hard disk500G
DVD+RWStandard  configuration
Operating System Windows 7 Professional (  64 bit)
Equipment Diemension 
and Weight
1000x1000x1525mm;780KG
Power220V,10A
Air Pressure4~6Bar
Power (Start / nornmal)Start:2.5kw /  Normal operation:2kw
Loading Requirements 
of the Floor
500kg/m²
OptionsMultifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, print 
closed-loop control, out-line programming software, maintenance was 
optionkstations, dynamic  Mark point  read function, coaxial  Mark  point camera , 
UPS continuous power supply 

 
 

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3D Solder Paste Inspection Machine Special Use for PCBA
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