Basic Info.
Function
High Temperature Resistance, Anti-Corrosion, Anti-Cold
Automatic Grade
Automatic
Mould Life
300,000-1,000,000 Shots
Machine Dimension
1000*1000*1525mm
Transport Package
Standard Wooden Package
Specification
1000*1000*1525mm 830KG
Product Description
FAQ
1) This is the first time I use this kind of machine, is it easy to operate?
There is English manual or guide video that show you how to use machine.
If you still have any question, please contact us by e-mail / skype/ phone /trade manager online service.
2) If machine have any problem after I receive it, how can I do ?
Free parts send to you in machine warranty period.
If the part is less than 0.5KG, we pay the postage.
If it exceeds 0.5KG, you need to pay the postage.
3) MOQ ?
1 set machine, mixed order is also welcomed.
4) How can I buy this machine from you? ( Very easy and flexible !)
A. Consult us about this product on line or by e-mail.
B. Negotiate and confirm the final price , shipping , payment methods and other terms.
C. Send you the proforma invoice and confirm your order.
D. Make the payment according to the method put on proforma invoice.
E. We prepare for your order in terms of the proforma invoice after confirming your full payment.
And 100% quality check before shipping.
F.Send your order by air or by sea.
5)Why choose us ?
A. Gold supplier on Made-in-china. !
B. Best price & Best shipping & Best service !
Features and parameter of our product:
1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line.
2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically driven by a piezoelectric motor(PZT).By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use and avoid mechanical wear and reduce maintenance costs.
3.By using the Stop&Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.
4.Patened D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.
5.Gerber data conversion and import, achieve automatic detection of the entire board. Manual "teach" function realize user-friendly programming and test job generation in case of no Gerber data situation.
6. The maximum detectable height increased from the traditional±350um to±1200um, not only can detect solder paste, also applies to the detection of opaque objects, such as red glue and black epoxy and other none transported object.
7.Friendly and simple user interface, five minutes of programming and one key operation.
8.Powerful "statistical process control(SPC)", Provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.
9.The application range like: mobile phones, tablet PC, computer and accessories, digital cameras, camcorders, automotive, medical, server, LED, FPC, communication products etc.
Products Description | Ultra high precision Model |
Model | Ultra series |
Measurement Principle | 3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly known as moire fringe technology) |
Measurements | Volume,acreage,height, XYoffset, shape |
Detection of Non - Performing Types | Missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination |
Camera Pixel | 5M, 8M/12M as option |
Lens Types | Telephoto lens, telecentric lens as option |
Lens Resolution | 10um(8/13/15/18/20um as option) |
FOV Size | 38.4*30.6mm (20.5*16.3/25.6*24.5/33.3*26.5/46.1*36.7/51.2*40.8mm) |
Accuracy | XY Resolution):1um;Height:0.37um, Light grating resolution:0.5um |
Repeatability | Height:<1um (6 Sigma);volume/acreage:<1%(6 Sigma) |
Gage R&R | <10% |
FOV Speed | 0.3s/FOV |
Quantity of Inspection Head | Tri-Heads (Four Heads as option) |
Red Green Blue/RGB Three Colas Option Light Source | Standard configuration |
Mark-point Detection Time | 0.5 sec/piece |
Compensation Plate Bending of Real-time Lift in Z-axis | Standard configuration |
Maximun Meauring Height | ±550um ( ±1200um as option) |
Maximun Measuring Height of PCB Warp | ±5mm |
Minimum Pad Spacing | 100um ( pad height of 150um as the reference) |
Smallest Measuring Size | Rectangle:150um;Round:200um |
Maximum Loading PCB Size | S:X330*Y250mm L:X510*Y505mm LL:X630*Y550mm |
Thickness of the PCB | 0.4-7mm |
Height Limitations of the Parts | Top30mm,Bottorm40mm |
Board Edge Distance | 3mm , (multifunctional clip edge as option) |
Flixble or Fixed Orbit Setting | Front orbit (back orbit as option) |
PCB Transfer Direction | Left to right or right to left |
Orbit Width Adjustment | Manual, automatic as option |
SPC Statistics | Histogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability Data;SPI Daily/Weekly/Monthly Reports |
Gerber & CAD Data Imput | Support Gerber format(274x,274d);Manual Teach model ; CAD X/Y,Part No.,Package Type imput |
Industry 4.0 Configuration | 1D/2D camera Barcode, Badmark function, print closed-loop control |
Computer type | DELL Precision Workstation |
Computer Configuration | CPU | Intel 6-core (Intel double CPU 12-core as option) |
RAM | 24G(32/48G as option) |
GPU | 2G discrete graphics (4G DP as option) |
Hard disk | 1T (2T as option) |
DVD+RW | Standard configuration |
Operating System | Windows 7 Professional ( 64 bit) |
Equipment Diemension and Weight | W1000xD1000xH1525mm;950KG |
Power | 220V,10A |
Air Pressure | 4~6Bar |
Power (Start / nornmal) | Start:2.5kw / Normal operation:2kw |
Loading Requirements of the Floor | 600kg/m² |
Options | Multifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, print closed-loop control, out-line programming software, maintenance was optionkstations, dynamic Mark point read function, coaxial Mark point camera , UPS continuous power supply |
If you have any questions, please contact me or call me directly
Address:
No. 9 Floor, B5-1 Building, Junfeng Industry Park, Fuyong, Shenzhen
Business Type:
Manufacturer/Factory
Business Range:
Computer Products, Consumer Electronics, Electrical & Electronics, Industrial Equipment & Components, Instruments & Meters, Lights & Lighting, Manufacturing & Processing Machinery, Packaging & Printing
Management System Certification:
ISO 9001, ISO 14001
Company Introduction:
SINIC-TEK Intelligent Technology Co., Ltd. Specializes in development, production, sales and value-added service on the software and hardware of 3D none destructive inspection system applied in PCBA and Semiconductor industry.
With over 20 years industry experienced engineers and researchers, SINIC-TEK Intelligent Technology Co., Ltd. Develops new and high precision none destructive inspection systems based on the advanced technology worldwide.
SINIC-TEK successfully launched China′s first 3D high-speed full inspection off-line SPI in 2009; SINIC-TEK is a Chinese brand holding the largest storage volume of equipment (more than 1, 500 sets), the largest output volume, the largest market share. SINIC-TEK launches T Series Desktop High Speed 3D Solder Paste Inspection System, which has 3 models, and they are T-1010A/T2010A and T-3010A, in order to meet all needs of customers, InSPIre series/S8080 series, 1.2 meters exclusive model, FPC exclusive model, LED exclusive model advanced features and easy to use.
With the vision of "new technology, new service and new development", SINIC-TEK is committed to establish a China′s own brand of world-class electronic assembly inspection system.
SINIC-TEK is committed to establish a China′s own brand of world-class electronic assembly inspection system and make successful story continue.